Round 4: Why the goo failed.. BONUS: core2 QX lapping!

[Red Squirrel]

Good thing the new cpus are flat now though, they used to expose the registers and stuff, was harder to put paste then and sometimes you'd end up with a mess.

But yeah the concave thing is not too good lol.

[cauzomb]

Good thing the new cpus are flat now though, they used to expose the registers and stuff, was harder to put paste then and sometimes you'd end up with a mess.

But yeah the concave thing is not too good lol.

CONCAVE=not good for sure.... The heat spreader is less troublesome than direct die cooling solutions... Although, I've never "fried" a chip, I do remember crunching an athlon 1200 under an alpha PAL heatsink. I wonder what's hapening to my silicon under the heatspreader though! is the substrate bending under the pressure of the socket CPU retainer? or just the edges of the IHS deflecting over some kind of softer sealant?