I have recently re-seated my CPU about 3 times trying to get a good contact patch with AS5 and have worked out an application technique that gives me reliable results; but a little messy and requires aditional burn-in due to the extra cpu goop needed for an even contact patch on the waterblock... I won't get into applying the goop, since there's plenty of info on their site... In the past I have had to wait several days for the AS5 to settle in; then temps start to look better than regular white thermal goop, or other metalic goops... This time I applied the AS5, installed the waterblocks to the chipset and CPU, turn on the computer WITHOUT the water pump running, left the pump off untill the cpu and chipset gets to the upper limmit of the temp specs, using MBM5 to watch it go up, THEN turn the pump on.

By allowing my cpu and chipset to go a little over 53c before turning the pump on, I have reduced the AS5 burn in from 5 days to 2 Im sure I could have heat cycled it in ONE day, instead of turning it off/on when needed/// But hey! now I know.